• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic device comprising a support plate (2) which has a mounting face (3) and an electronic chip (8) which has a front face (9) and a rear face (10) opposite to its front face and which is mounted on the support plate in a position such that the front face of the chip is facing the mounting face of the support plate. The rear face (10) of the chip is provided with a plurality of rear grooves (14), so that the rear face (10) of the chip 8 has, between said grooves (14), rear zones (15). . A backing layer (16) of a heat conductive material is spread over the rear face (10) of the chip so as to at least partially cover said rear areas (15) and to at least partially fill said rear grooves (14). ).
    公开号:FR3061600A1
    申请号:FR1750049
    申请日:2017-01-03
    公开日:2018-07-06
    发明作者:Laurent Figuiere；Gaetan Lobascio；Alexandre Mas
    申请人:STMicroelectronics Tours SAS；STMicroelectronics Grenoble 2 SAS；
    IPC主号:
    专利说明:

    @ Holder (s): STMICROELECTRONICS (GRENOBLE
    2) SAS Simplified joint stock company, STMICROELECTRONICS (TOURS) SAS Simplified joint stock company.
    O Extension request (s):
    (® Agent (s): CASALONGA.
    ® ELECTRONIC DEVICE COMPRISING A GROOVED CHIP.
    FR 3 061 600 - A1 (57) Electronic device comprising a support plate (2) which has a mounting face (3) and an electronic chip (8) which has a front face (9) and a rear face (10) opposite its front face and which is mounted on the support plate in a position such that the front face of the chip is opposite the mounting face of the support plate. The rear face (10) of the chip is provided with a plurality of rear grooves (14), so that the rear face (10) of the chip 8 has, between said grooves (14), rear zones (15) . A rear layer (16) of a heat conductive material is spread over the rear face (10) of the chip so as to cover at least partially said rear areas (15) and at least partially fill said rear grooves (14 ).

    Electronic device including a grooved chip
    The present invention relates to the field of electronic devices including electronic chips.
    Some electronic chips produce heat. Many means of heat dissipation, placed in the immediate environment of chips, are known. However, the evolution of technology means that the amount of heat to be removed is more and more important.
    The present invention aims to improve the dissipation of the heat produced by electronic chips.
    According to one embodiment, an electronic device is proposed which comprises a support plate which has a mounting face and an electronic chip which has a front face and a rear face opposite its front face and which is mounted on the plate. support in a position such that the front face of the chip is opposite the mounting face of the support plate.
    The rear face of the chip is provided with a plurality of rear grooves, so that the rear face of the chip has, between said grooves, rear zones, and comprises a rear layer of a heat conductive material which is spread out on the rear face of the chip so as to at least partially cover said rear areas and at least partially fill said rear grooves.
    Optionally, said rear layer of a heat conductive material can cover the entire rear face of the chip and can completely fill said rear grooves of the chip.
    A heat dissipating member can be attached to a rear face of said heat conducting layer.
    The heat dissipating member may include a plate forming a radiator.
    A cover may be provided to encapsulate the chip, in the form of a cup, this cover having a central part contiguous to said heat conducting layer and having a peripheral part mounted on said support plate by means of a local layer of fixation.
    Said heat conducting layer may comprise an epoxy resin charged with metallic particles.
    The chip may include, on the side of its front face, a layer including electronic components and electrical connection means.
    Said grooves can be arranged in rows and columns.
    The chip can be mounted on the support plate by means of electrical connection elements.
    There is also proposed an electronic chip having a front face provided with electrical connection pads and a rear face, the rear face having a plurality of rear grooves and rear zones between these grooves, the rear face of the chip having, between said grooves , rear zones, said rear face being provided with a rear layer of a heat conducting material which is spread out so as to cover at least partially said rear zones and at least partially fill said rear grooves.
    A method of producing an electronic device is also proposed, which includes the following steps:
    mounting on a sawing adhesive film a semiconductor substrate comprising, on and in a front face, a plurality of electronic circuits, said front face facing said adhesive film; and sawing the rear face of the semiconductor substrate over a portion of its thickness and according to a plurality of saw cuts forming a plurality of grooves;
    - sawing the semiconductor substrate over its entire thickness along cutting lines located between said electronic circuits in order to singulate electronic chips;
    - Mount an electronic chip on a support plate, in a position such that the front face of the electronic chip is opposite the support plate, the rear face of the chip having rear zones separated by grooves; and
    spreading a rear layer of a heat-conducting material on the rear face of the chip, so as to cover at least partially said rear zones and at least partially fill the rear grooves.
    An electronic device will now be described by way of nonlimiting example of embodiment, illustrated by the appended drawing in which:
    Figure 1 electronics; represented a chopped off of a device figure 2 represented a rear view of a chip electronics of the electronic device of Figure 1; figure 3 represented a chopped off of the device electronic the figure 1, fitted with a heatsink heat; and figure 4 represented a chopped off of the device electronic Figure 1, provided another heat sink heat.
    In FIGS. 1 and 2 is illustrated an electronic device 1 which comprises a support plate 2 made of a dielectric material, which has a front mounting face 3 and a rear face 4 and which includes a network of electrical connections 5 having electrical contacts 6 on the front face 3 and electrical contacts 7 on the rear face 4.
    The electronic device 1 comprises an electronic chip 8 which has a front face 9 and a rear face 10 opposite and parallel to its front face 9 and which comprises, on the side of its rear face 10, a substrate wafer 11, for example made of silicon , and, on the side of its front face 9, a layer 12 including electronic components arranged on the substrate board 11 and a network of electrical connections.
    The electronic chip 8 is mounted on the support plate 2 in a position such that the front face 9 of the chip 8 is opposite the mounting face 3 of the support plate 2, by means of welded elements of electrical connection 13, such as balls, which connect the network of electrical connections of the layer 12 of the chip 8 and the front pads 6 of the support plate 2.
    The rear face 10 of the chip 8 is provided with a plurality of rear grooves 14 which are arranged in the substrate board 11, so that the rear face 10 of the chip 8 has, between the grooves 14, rear zones 15 .
    By way of example illustrated in FIGS. 1 and 2, the rear grooves 14 constitute lines and columns parallel to the sides of the chip 8, in the form of a square matrix, and extend respectively from an edge to the other.
    The rear grooves 14 can be produced by machining using a milling, sawing, laser equipment tool or by plasma etching.
    Advantageously, the rear grooves 14 can be produced during a collective manufacture of a plurality of electronic chips 8, which comprises the following steps.
    A semiconductor substrate comprising, on and in a front face, a plurality of electronic circuits is mounted on a sawing adhesive film, said front face facing said adhesive film.
    The rear face of the semiconductor substrate is sawed over a portion of its thickness and according to a plurality of saw cuts forming a plurality of collective grooves.
    Then, one proceeds to sawing the semiconductor substrate over its entire thickness according to cut lines located between said electronic circuits in order to simulate electronic chips 8, so that the rear face of each chip 8 has rear zones 15 separated by grooves 14 formed by portions of said collective grooves.
    The electronic device 1 also comprises a rear layer 16, made of a heat-conducting material, which is spread over the rear face 10 of the chip 8, so as to cover the areas 15 of the rear face 10 of the chip 8 and to fill the rear grooves 14 of the chip 8, advantageously without discontinuity. The rear layer 16 has a rear face 17, for example flat, which is located at a distance from the rear face 10 of the chip 8 and which determines its thickness above the rear zones 15 and above the rear grooves 14.
    Thus, the heat flux passing from the chip 8 to the rear layer 16, intervenes via the increased interface between the chip 8 and the rear layer 16, which includes the rear zones 15 and the walls of the rear grooves 14. The heat flux captured by the rear layer 16 is discharged via the rear face 17 of this rear layer 16.
    According to an alternative embodiment, the rear grooves 16 could be produced on a local region of the rear face 10 of the chip 8 and the rear layer 16 could be limited to this region.
    The heat-conducting rear layer 16 can be a suitable adhesive-filled resin, in particular an epoxy resin loaded with metallic particles, in particular copper or aluminum. For its implementation, the material can be spread in the liquid or pasty state on the rear face 10, then hardened.
    According to an alternative embodiment illustrated in FIG. 1, the rear face 17 of the heat-conducting rear layer 16 is in the open air.
    According to an alternative embodiment illustrated in FIG. 3, the electronic device 1 comprises a member 18 for dissipating heat, attached to the rear face 17 of the rear layer 16 conducting heat. According to an exemplary embodiment, the member 18 for dissipating the heat from the chip 8 via the rear layer 16 may be in the form of a metal plate having a shape suitable for constituting a radiator.
    According to an alternative embodiment illustrated in FIG. 4, the electronic device 1 comprises a metal cover 19 for encapsulating the chip 8 above the support plate 2.
    The encapsulation cover 19 is in the form of a bowl and comprises a flat central part 19a contiguous to the rear face 17 of the rear layer 16 conductive of heat and an offset peripheral part 19b surrounding the periphery of the chip 8 and fixed to the mounting face 3 of the support plate 2 by means of a local layer of glue 20, preferably an glue made of a heat-conducting material, for example similar to that of the rear layer 16. Thus, the encapsulation cover 19 constitutes a heat sink from the chip 8 via the rear layer 16.
    According to an alternative embodiment, the encapsulation cover 19 is metallic and the local adhesive layer 20 is also electrically conductive and is fixed to the mounting face 3 of the support plate 2 at the level of front studs 6 of the support plate 2, these front studs being connected to electrical contacts 7 on the rear face 4 via the network of electrical connections 5. The encapsulation cover 19 can thus be grounded and also form an electromagnetic shield for chip 8.
    权利要求:
    Claims (11)
    [1" id="c-fr-0001]
    1. Electronic device comprising a support plate (2) which has a mounting face (3) and an electronic chip (8) which has a front face (9) and a rear face (10) opposite its front face and which is mounted on the support plate in a position such that the front face of the chip faces the mounting face of the support plate, device in which the rear face (10) of the chip is provided with a plurality rear grooves (14), so that the rear face (10) of the chip (8) has, between said grooves (14), rear zones (15), and comprising a rear layer (16) of a conductive material heat which is spread over the rear face (10) of the chip so as to at least partially cover said rear zones (15) and at least partially fill said rear grooves (14).
    [2" id="c-fr-0002]
    2. Device according to claim 1, wherein said rear layer (16) of a heat conductive material covers the entire rear face of the chip and completely fills said rear grooves of the chip.
    [3" id="c-fr-0003]
    3. Device according to one of claims 1 and 2, comprising a heat dissipation member (18, 19) attached to a rear face (17) of said heat conducting layer (16).
    [4" id="c-fr-0004]
    4. Device according to claim 3, wherein said heat dissipation member comprises a plate (18) forming a radiator.
    [5" id="c-fr-0005]
    5. Device according to any one of the preceding claims, comprising a cover (19) for encapsulating the chip, cup-shaped, having a central part (19a) attached to said layer (16) conductive of heat and having a peripheral part (19b) mounted on said support plate (2) by means of a local fixing layer (20).
    [6" id="c-fr-0006]
    6. Device according to any one of the preceding claims, in which said heat conducting layer (16) comprises an epoxy resin charged with metallic particles.
    [7" id="c-fr-0007]
    7. Device according to any one of the preceding claims, in which the chip comprises, on the side of its front face, a layer (12) including electronic components and electrical connection means.
    [8" id="c-fr-0008]
    8. Device according to any one of the preceding claims, wherein said grooves are arranged in rows and columns.
    [9" id="c-fr-0009]
    9. Device according to any one of the preceding claims, in which the chip is mounted on the support plate by means of electrical connection elements (13).
    [10" id="c-fr-0010]
    10. Electronic chip having a front face (9) provided with electrical connection pads and a rear face, the rear face having a plurality of rear grooves and rear zones between these grooves, the rear face (10) of the chip (8 ) having, between said grooves (14), rear zones (15), said rear face (10) being provided with a rear layer (16) of a heat-conducting material which is spread so as to cover at least in part said rear areas (15) and at least partially fill said rear grooves (14).
    [11" id="c-fr-0011]
    11. Method for producing an electronic device, comprising the following steps:
    mounting on a sawing adhesive film a semiconductor substrate comprising, on and in a front face, a plurality of electronic circuits, said front face facing said adhesive film;
    sawing the rear face of the semiconductor substrate over a portion of its thickness and according to a plurality of saw cuts forming a plurality of grooves;
    - sawing the semiconductor substrate over its entire thickness along cutting lines located between said electronic circuits in order to singulate electronic chips;
    - mounting an electronic chip on a support plate, in a position such that the front face of the electronic chip is facing the support plate, the rear face of the chip having rear zones (15) separated by grooves ( 14); and
    - spreading a rear layer (16) of a heat-conducting material on the rear face (10) of the chip, so as to cover at least partially said rear areas (15) and at least partially fill the rear grooves (14).
    1/2
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3061600A1|2018-07-06|ELECTRONIC DEVICE COMPRISING A GROOVE CHIP
    US9252101B2|2016-02-02|Packages for three-dimensional die stacks
    JP4688526B2|2011-05-25|Semiconductor device and manufacturing method thereof
    EP2960937B1|2018-05-16|Integrated circuit comprising a heat sink
    US8519526B2|2013-08-27|Semiconductor package and fabrication method thereof
    US20110049704A1|2011-03-03|Semiconductor device packages with integrated heatsinks
    US20090027857A1|2009-01-29|Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry
    US9859266B2|2018-01-02|Method of forming 3D integrated circuit package with panel type lid
    US20080128895A1|2008-06-05|Wafer applied thermal-mechanical interface
    JP4062157B2|2008-03-19|Semiconductor module mounting structure
    WO2019021720A1|2019-01-31|Semiconductor device and production method for semiconductor device
    FR3011979A1|2015-04-17|ELECTRONIC DEVICE WITH CHIP OF INTEGRATED CIRCUITS AND ELECTRONIC SYSTEM
    US10763417B2|2020-09-01|Thermal block assembly, LED arrangement with the same, and method of manufacturing said thermal assembly
    NL2011840B1|2016-07-04|Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof.
    US20210143108A1|2021-05-13|Semiconductor Device Having a Thin Semiconductor Die
    US10763406B2|2020-09-01|Semiconductor component comprising a first and a second shaped body and method for producing a semiconductor component comprising a first and a second shaped body
    JP2004528702A|2004-09-16|Microelectronic component lids, thermal spreaders, and semiconductor packages
    KR20090087436A|2009-08-17|Optoelectronic component
    US20130181225A1|2013-07-18|Semiconductor device and method of manufacturing the same
    US9559036B1|2017-01-31|Integrated circuit package with plated heat spreader
    JP2012064855A|2012-03-29|Semiconductor device
    KR20080048100A|2008-06-02|Chip package having cooling hole and method for manufacturing thereof
    WO2018115709A1|2018-06-28|Power electronics module comprising a heat exchange face
    FR3060942A1|2018-06-22|METHOD FOR MANUFACTURING AN ASSEMBLY COMPRISING A MECHANICAL STRUCTURE AND AN ELECTRIC POWER COMPONENT FOR AN AIRCRAFT
    JP2011096758A|2011-05-12|Insulated radiating substrate
    同族专利:
    公开号 | 公开日
    CN207320090U|2018-05-04|
    CN108269772A|2018-07-10|
    US20180190562A1|2018-07-05|
    FR3061600B1|2020-06-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP0883192A2|1997-06-05|1998-12-09|Lsi Logic Corporation|Grooved semiconductor die for flip-chip sink attachment|
    US20010040298A1|2000-05-12|2001-11-15|Shunji Baba|Method of mounting chip onto printed circuit board in shortened working time|
    US20050263859A1|2004-05-27|2005-12-01|Semiconductor Components Industries, Llc.|Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof|
    WO2006022911A1|2004-08-18|2006-03-02|Advanced Micro Devices, Inc.|Integrated circuit with increased heat transfer|
    US20060043576A1|2004-08-25|2006-03-02|Hsin-Hui Lee|Structures and methods for heat dissipation of semiconductor integrated circuits|
    US20090189279A1|2008-01-24|2009-07-30|National Semiconductor Corporation|Methods and systems for packaging integrated circuits|
    US20120241941A1|2011-03-21|2012-09-27|Stats Chippac, Ltd.|Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die|
    FR3012670A1|2013-10-30|2015-05-01|St Microelectronics Grenoble 2|ELECTRONIC SYSTEM COMPRISING STACKED ELECTRONIC DEVICES WITH INTEGRATED CIRCUIT CHIPS|
    US6038133A|1997-11-25|2000-03-14|Matsushita Electric Industrial Co., Ltd.|Circuit component built-in module and method for producing the same|
    US20030228908A1|2002-06-10|2003-12-11|Daniel Caiafa|Statistics system for online console-based gaming|
    CN1737072B|2004-08-18|2011-06-08|播磨化成株式会社|Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent|
    US8907461B1|2013-05-29|2014-12-09|Intel Corporation|Heat dissipation device embedded within a microelectronic die|
    FR3061600B1|2017-01-03|2020-06-26|Stmicroelectronics Sas|ELECTRONIC DEVICE COMPRISING A GROOVED CHIP|FR3061629A1|2017-01-03|2018-07-06|StmicroelectronicsSas|METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    FR3061600B1|2017-01-03|2020-06-26|StmicroelectronicsSas|ELECTRONIC DEVICE COMPRISING A GROOVED CHIP|
    FR3061630B1|2017-01-03|2021-07-09|St Microelectronics Grenoble 2|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|
    FR3061628A1|2017-01-03|2018-07-06|StmicroelectronicsSas|METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    CN110148589B|2019-05-21|2020-11-03|上海理工大学|Chip assembly and chip refrigerating device based on pulse tube micro-channel|
    CN111554644A|2020-06-12|2020-08-18|厦门通富微电子有限公司|Chip, chip package and wafer|
    CN111554586A|2020-06-12|2020-08-18|厦门通富微电子有限公司|Preparation method of chip packaging body|
    CN111799185A|2020-07-03|2020-10-20|徐彩芬|Tube core packaging structure and preparation method thereof|
    法律状态:
    2017-12-18| PLFP| Fee payment|Year of fee payment: 2 |
    2018-07-06| PLSC| Search report ready|Effective date: 20180706 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 4 |
    2021-10-08| ST| Notification of lapse|Effective date: 20210905 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1750049|2017-01-03|
    FR1750049A|FR3061600B1|2017-01-03|2017-01-03|ELECTRONIC DEVICE COMPRISING A GROOVED CHIP|FR1750049A| FR3061600B1|2017-01-03|2017-01-03|ELECTRONIC DEVICE COMPRISING A GROOVED CHIP|
    US15/689,828| US20180190562A1|2017-01-03|2017-08-29|Electronic device having a grooved chip|
    CN201710855202.8A| CN108269772A|2017-01-03|2017-09-20|Include the electronic device for chip of slotting|
    CN201721209121.2U| CN207320090U|2017-01-03|2017-09-20|Electronic device and electronic chip|
    [返回顶部]